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Discussion Leading Edge Foundry Node advances (TSMC, Samsung Foundry, Intel) - [2020 - 2025]

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DisEnchantment

Golden Member
TSMC's N7 EUV is now in its second year of production and N5 is contributing to revenue for TSMC this quarter. N3 is scheduled for 2022 and I believe they have a good chance to reach that target.

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N7 performance is more or less understood.
1587739093721.png

This year and next year TSMC is mainly increasing capacity to meet demands.

For Samsung the nodes are basically the same from 7LPP to 4 LPE, they just add incremental scaling boosters while the bulk of the tech is the same.

Samsung is already shipping 7LPP and will ship 6LPP in H2. Hopefully they fix any issues if at all.
They have two more intermediate nodes in between before going to 3GAE, most likely 5LPE will ship next year but for 4LPE it will probably be back to back with 3GAA since 3GAA is a parallel development with 7LPP enhancements.


1587739615344.png

Samsung's 3GAA will go for HVM in 2022 most likely, similar timeframe to TSMC's N3.
There are major differences in how the transistor will be fabricated due to the GAA but density for sure Samsung will be behind N3.
But there might be advantages for Samsung with regards to power and performance, so it may be better suited for some applications.
But for now we don't know how much of this is true and we can only rely on the marketing material.

This year there should be a lot more available wafers due to lack of demand from Smartphone vendors and increased capacity from TSMC and Samsung.
Lots of SoCs which dont need to be top end will be fabbed with N7 or 7LPP/6LPP instead of N5, so there will be lots of wafers around.

Most of the current 7nm designs are far from the advertized density from TSMC and Samsung. There is still potential for density increase compared to currently shipping products.
N5 is going to be the leading foundry node for the next couple of years.

For a lot of fabless companies out there, the processes and capacity available are quite good.

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FEEL FREE TO CREATE A NEW THREAD FOR 2025+ OUTLOOK, I WILL LINK IT HERE
 
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Intel investor lmao it might be true though

It is no surprise. Demand for both logic and memory is through the roof.


"We are seeing that TSMC is hitting (production capacity) limits," Natarajan Ramachandran, director of product marketing in Broadcom’s Physical Layer Products division, told reporters on Tuesday, adding he would have described TSMC's capacity as "infinite" until a few years ago.
 
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@RTX would be interesting to see more specific information on GF's claims. What exactly did Tower steal from them, if anything?

The court filings would list the 11 patents. I'm sure there will be articles written that link them.

Edit: here is the relevant text from the lawsuit:

1. This is a civil action for infringement of United States Patent Nos. 11,476,244 (“the
’244 Patent”), 8,283,193 (“the ’193 Patent”), 11,658,177 (“the ’177 Patent”), 7,566,653 (“the ’653
Patent”), and 9,269,666 (“the ’666 Patent”) (collectively, “the Asserted Patents”) under the patent
laws of the United States, 35 U.S.C. § 1 et seq.
2. To address Tower’s widespread infringement of GlobalFoundries’ patents,
GlobalFoundries U.S. has also brought suit against Tower in both the Western District of Texas,
and the United States International Trade Commission, asserting U.S. Patent Nos. 10,062,748;
8,507,983; 9,093,425; 9,865,546; 10,707,167; and 8,330,235. Those patents are distinct from, and
unrelated to, the Asserted Patents here.
 
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